Unparalleled Advancements in Signal- and Power-Integrity, Electromagnetic Compatibility Testing
SOUTHPOINTE, PA - June 16, 2009 - ANSYS, Inc. (NASDAQ: ANSS), a global innovator of simulation software and technologies designed to optimize product development processes, today announced the latest release of SIwave(TM) software. Part of the Ansoft family of products, version 4.0 of this technology includes new features for signal-integrity, power-integrity and electromagnetic compatibility testing. It includes numerous enhancements including an improved desktop graphical user interface with new post-processing of results, solver enhancements that provide accurate solutions beyond 10 Gb/s, and automation that links SIwave electromagnetics with circuit simulation using Ansoft Designer® and Nexxim®. Additionally, a new link between electromagnetics and thermal analysis has been created for board and package thermal effects via ANSYS® Icepak® software. The link enables accurate characterization of additional heating due to copper-resistive losses that engineers have previously estimated or ignored completely.
SIwave technology is an electromagnetic field solver that performs broadband signal- and power-integrity analyses along with DC voltage and current analysis for complete boards and packages. SIwave software offers comprehensive electromagnetic interference and compatibility analyses, and it has the unique ability to couple board and package electromagnetic fields with HFSS(TM) technology for complete system-level simulation.
"SIwave 4.0 will allow designers to continually push the envelope of high-speed design, deliver first-in-class performance, and go beyond the 10 Gb/s design barrier that exists in high-performance computing," said Dr. Zol Cendes, chief technology officer and general manager at Ansoft. "These advancements in electrical simulation plus the coupling between SIwave and ANSYS Icepak provide a comprehensive solution for our customers."